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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                SMT high speed dicing machine, semi automatic PCB depaneling machine, production line dicing machine with warranty
                              

Gewicht:	850 kg	Leistung:	10 kW
Stromspannung:	220V/110V	Y-Achsenanschlag:	310mm
Abmessungen:	104010801750mm	Luftverbrauch:	200 l/min
Maschinenleistung:	4 kW	Luftdruck:	0,5-0,6 MPA
Maximaler Materialdurchmesser:	300 mm	Spindelleistung:	2,4 KILOWATT
Spindelgeschwindigkeit:	60,000 U/min	Positionierungsgenauigkeit:	0,001 mm
Schnittgeschwindigkeit:	0,05–400 mm/Sek	Standardklinge:	2 Zoll
Max Blade:	3 Zoll

Gewicht:	850 kg
Leistung:	10 kW
Stromspannung:	220V/110V
Y-Achsenanschlag:	310mm
Abmessungen:	104010801750mm
Luftverbrauch:	200 l/min
Maschinenleistung:	4 kW
Luftdruck:	0,5-0,6 MPA
Maximaler Materialdurchmesser:	300 mm
Spindelleistung:	2,4 KILOWATT
Spindelgeschwindigkeit:	60,000 U/min
Positionierungsgenauigkeit:	0,001 mm
Schnittgeschwindigkeit:	0,05–400 mm/Sek
Standardklinge:	2 Zoll
Max Blade:	3 Zoll

SMT High Speed Semi Automatic Dicing Machine for Production Line

The dicing system utilizes a slim cutting blade mounted on a high-speed spindle to precisely cut materials including glass, ceramic, semiconductor chips, PCB, EMC wire frames, and other substrates with exceptional accuracy.

Operation Procedures

Wafer or Strip

Tape mounting

Dicing

Cleaning

UV separation

Semi-Automatic Dicing System Description

The semi-automatic dicing system features manual loading and unloading operations while automating the core dicing procedure. This system does not include automatic cleaning or drying functions.

Main Procedures

Feeding by hand

Position align

Auto-cutting

Unloading by hand

Operator manually places cutting material on work platform
Automatic calibration of cutting position
Press start button to automatically complete dicing process
Operator manually removes finished material from work platform

Applications

Automatic dicing systems are widely used for precision cutting of semiconductor chips, LED chips, EMC lead frames, PCB boards, IR filters, sapphire glass, and ceramic thin plates.

Ceramic substrate

Silicon rubber

Lead frame

Silicon wafer

PCB

Glass

Operating Requirements

Use clean compressed air with atmospheric pressure dew point of -10°C to -20°C, residual oil content of 0.1ppm, and filtration accuracy above 0.01μm/99.5%
Operate in environment temperature of 20°C to 25°C with fluctuation range controlled at ±1°C
Maintain cutting water temperature at 22°C to 27°C (±1°C variation) and cooling water at 20°C to 25°C (±1°C variation)
Avoid external impacts and vibrations; do not install near high-temperature devices like blowers or vents, or equipment generating oil mist
Strictly follow provided product manual for operation

YSL-1000SD Semi-Dicing System Features

Control Interface	Touch LCD with simple interface design, multiple language support (Chinese, English, Korean)
Maximum Material Size	300mm diameter high precision cutting capability
Structural Design	High rigidity design ensuring precision and stability during cutting process
Alignment System	CCD automatic alignment
Monitoring System	Real-time monitoring of air pressure, water pressure, current values to prevent spindle damage
Cutting Spindle	2.4 kW × 1 set (Maximum: 60,000 rpm)
Positioning Accuracy	0.001mm repeat positioning accuracy
Cutting Speed	0.05 ~ 400 mm/sec
Standard Blade	2 Inch (Maximum: 3 Inch)

Case Sharing

Optional Equipment

Blade damage detection function
Automatic setting function
Dicing visual function
3-inch dicing blade compatibility

Platform Capacity Comparison

Standard 8-inch working platforms accommodate only 2 pieces of material. The SDS1000/ADS2000 models feature 12-inch chucks capable of holding 4 pieces per cycle, reducing loading times, accommodating larger products, and improving efficiency by over 8%.

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SMT High Speed Semi Automatic Dicing Machine for Production Line

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