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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                high precision solder paste printer, automatic SMT assembly printer, PCB depaneling solder printer
                              

Gewicht:	1500 kg	Leistung:	10 kW
Stromspannung:	220V/380V	Abbrechabstand:	0-20mm
Stromquelle:	Wechselstrom: 220 ± 10 % 50/60 Hz, 3 kW	Luftdruck:	4 bis 6 kgf/cm2
Luftverbrauch:	5l/min	Betriebstemperatur:	-20℃-+45℃
Maximale Boardgröße:	900*350mm	Mindestgröße der Platte:	80*50 mm
Brettstärke:	0,8*6mm	Höchstgewicht der Platte:	10 kg
Transportgeschwindigkeit:	Bei der Prüfung der Leistungsfähigkeit ist die Leistung zu messen.	Wiederholungspositionsgenauigkeit:	±0.015mm
Druckgenauigkeit:	±0,03 mm

Gewicht:	1500 kg
Leistung:	10 kW
Stromspannung:	220V/380V
Abbrechabstand:	0-20mm
Stromquelle:	Wechselstrom: 220 ± 10 % 50/60 Hz, 3 kW
Luftdruck:	4 bis 6 kgf/cm2
Luftverbrauch:	5l/min
Betriebstemperatur:	-20℃-+45℃
Maximale Boardgröße:	900*350mm
Mindestgröße der Platte:	80*50 mm
Brettstärke:	0,8*6mm
Höchstgewicht der Platte:	10 kg
Transportgeschwindigkeit:	Bei der Prüfung der Leistungsfähigkeit ist die Leistung zu messen.
Wiederholungspositionsgenauigkeit:	±0.015mm
Druckgenauigkeit:	±0,03 mm

YS-900 High Precision Fully Automatic Solder Paste Printer for SMT Assembly Line

Advanced Image and Optical System

Features uniform ring light and high brightness coaxial light with programmable brightness adjustment function. Capable of recognizing all types of Mark points, including rugged Mark points. Suitable for tin plating, coppering, gold plating, tin spraying, FPC and other types of PCB with different colors. Utilizes YUSH patent mathematical model to ensure high accuracy.

User-Friendly Operating Interface

Windows XP/Win 7 operating interface with YUSH user-friendly software. Chinese/English selectable interface includes Menu, Operating Journal, Breakdown Record, Breakdown Diagnosis, Error Analysis, and Light Alarm functions.

2D Solder Paste Print Quality Inspection System

The integrated 2D system immediately detects solder paste deposition defects including deviation, lack of paste, missing paste, and paste joint issues, ensuring consistent print quality.

Adjustable Stepping Motor with Programmable Floating Print-heads

Unique long platform and track fixed design ensures stable PCB support. Short squeegee horizontal printing provides pressure stability and saves solder paste.

Electric Control System

Safe and tidy distribution of electric circuit and gas circuit. Electric and gas pathways are positioned vertically at the two sides and back of machine for easy inspection and maintenance.

Technical Specifications

Substrate Processing
Maximum board size	900 × 350mm
Minimum board size	80 × 50mm
Board thickness	0.8 - 6mm
Maximum board weight	10KG
Board edge clearance	3.5mm
Board height	15mm
Transport height	900 ± 40mm
Transport speed	1500mm/s (MAX)
Transport direction	One stage
Board clamp	Patented over the top clamping / Side Clamping
Support System	Magnetic Pin / Support Block / Automatic UP-Down table
Vision System
CCD FOV	10 × 8mm
Fiducial mark types	Standard Fiducial mark shape / Pad / Hole
Camera System	Look up/down optics structure, CCD digital camera, Geometry pattern match
Machine Performance
Repeat Position Accuracy	±0.015mm
Print Accuracy	±0.03mm
Cycle time	<15sec

Based on third party test system (CTQ) to verify actual solder paste printing position repeat precision.

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YS-900 High Precision Fully Automatic Solder Paste Printer for SMT Assembly Line

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